Prediction of durability of soldered contact joints of chips
The study is aimed at developing a nondestructive testing method for electronic equipment and its components. This method allows one to identify critical design defects of printed circuit boards (PCB) and to predict their service life taking into account the nature of probable operating loads. The study uses an acoustic emission method to identify and localize critical design defects of printed circuit boards. Geometric dimensions of detected critical defects can be determined by X-ray tomography. Based on the results of the study, a method combining acoustic emission and X-ray tomography has been developed for nondestructive testing of printed circuit boards. The stress-strain state of solder joints containing detected defects is analyzed. Durability is predicted using the damage function of the material, experimental fatigue curve with allowance for rheological properties of materials, the temperature effects, and complex stress-strain state. The results of using the developed method for estimating the degree of damage of the electronic board have been verified based on the experimental results of studies carried out in accordance with IPC-9701. The prediction error does not exceed 5%. Contribution of the authors: the authors contributed equally to this article. The authors declare no conflicts of interests.
Keywords
printed circuit boards,
solder joint,
chip,
latent defect,
nondestructive testing method,
reliability,
durabilityAuthors
| Azin Anton V. | Tomsk State University | antonazin@mail.ru |
| Maritsky Nikolay N. | Tomsk State University | nnmar.niipmm@mail.ru |
| Ponomarev Sergey V. | Tomsk State University | psv@niipmm.tsu.ru |
| Rikkonen Sergey V. | Tomsk State University | rikk2@yandex.ru |
Всего: 4
References
5 главных причин отказа паяных соединений // Soft engineering group. 2020. URL: https://www.ansys.soften.com.ua/about-ansys/blog/544-top-5-reasons-solder-joint-failure.html
What is a Solder Void? // PCB Directory. 2020. URL: https://www.pcbdirectory.com/community/what-is-solder-voiding
Hillman D., Adams D., Pearson T., Williams B., Petrick B., Wilcoxon R. The last will and testament of the BGA void. 2011. 15 p. URL: https://www.circuitinsight.com/pdf/last_testament_bga_void_smta.pdf
Azin A., Zhukov А., Narikovich А., Ponomarev S., Rikkonen S., Leitsin V. Nondestructive testing method for a new generation of electronics // MATEC Web of Conferences. 2018. V. 143. Art. 04007. doi: 10.1051/matecconf/201814304007
Ponomarev S. V., Rikkonen S., Azin A., Karavatskiy A., Maritskiy N., Ponomarev S.A. The ap plicability of acoustic emission method to modeling the endurance of metallic construction elements // IOP Conference Series: Materials Science and Engineering. 2015. V. 71, No. 1. Art. 012056. doi: 10.1088/1757-899X/71/1/012056
Симонов Ю.Н., Симонов М.Ю. Физика прочности и механические испытания металлов : курс лекций. Пермь : Изд-во Перм. нац. исслед. политехи. ун-та, 2020.
Музыка Н.Р., Щвец В.П. Влияние вида нагружения на процесс накопления повреждений в материале // Проблемы прочности. 2014. № 1. C. 130-136.
Лучкин Р.С. Прочность и надежность паяных конструкций. Тольятти : Изд-во Тольяттинского гос. ун-та, 2014.
Иванов А.В., Пиганов М.Н. Оценка качества паяных соединений электронных узлов // Известия Самарского научного центра Российской академии наук. 2016. Т. 18, № 4-7. C. 1381-1386.
Парфенов А.Н. Введение в теорию прочности паяных соединений // Технологии в электронной промышленности. 2008. № 2. C. 46-52.
Локощенко А.М. Эквивалентные напряжения в расчетах длительной прочности металлов при сложном напряженном состоянии (обзор) // Известия Саратовского университета. Новая серия. Сер. Математика. Механика. Информатика. 2009. Т. 9, № 4. С. 128135. doi: 10.18500/1816-9791-2009-9-4-2-128-135
Bansal A., Ramakrishna G., Liu K. Investigation of Pad Cratering in Large Flip-Chip BGA using Acoustic Emission // IPC APEX EXPO Proceedings. 2011. 12 p.
Москвитин В.В. Сопротивление вязкоупругих материалов. М. : Наука, 1972.
Otiaba K.C., Bhatti R.S., Ekere N.N., Mallik S., Ekpu M. Finite element analysis of the effect of silver content for Sn-Ag-Cu alloy compositions on thermal cycling reliability of solder die attach // Engineering Failure Analysis. 2013. V. 28. P. 192-207. doi: 10.1016/j.engfailanal.2012.10.008
Ladani L.J., Dasgupta A. A meso-scale damage evolution model for cyclic fatigue of viscoplastic materials // International J. of Fatigue. 2009. V. 31. P. 703-711. doi: 10.1016/j.ijfatigue.2008.03.013
