About the mechanism for reducing the adhesion wear of the copper friction pair in the inert atmosphere by the nitrogen ions implantation method

The mechanisms of increasing the resistance of copper samples treated with a high-energy beam of nitrogen ions to adhesive wear during friction together with a copper counterbody in an argon atmosphere are studied. It was shown that the increase in wear resistance is complex and is associated with the action of mechanisms such as solid-solution hardening, grinding of copper grains, precipitation of the finely dispersed CuN₃ phase, increase in the density of dislocations and internal stresses of the second kind in the surface layer . The maximum increase in wear resistance and microhardness (~ 4 and ~ 2.6 times, respectively, compared with the original copper) is observed about ion fluence of ~ 9×10¹⁷ ion/cm². A further increase in fluencies leads to a decrease in wear resistance and microhardness due to the enlargement of the pores formed in the surface layer of copper as a result of implantation of nitrogen ions.

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