Adhesion strenghtof Ni-Cu surface alloy formed by a low-energy hight-current electron beam | Izvestiya vuzov. Fizika. 2020. № 10. DOI: 10.17223/00213411/63/10/151

Adhesion strenghtof Ni-Cu surface alloy formed by a low-energy hight-current electron beam

Measurements of the adhesion strength of a Ni-Cu surface alloy onto a Cu substrate for different thicknesses of the transition layer of the coating are carried out. The surface alloy was formed using a low-energy high-current electron beam (LEHCEB) of microsecond duration, while the thickness of the transition layer of the coating was controlled by the thickness of the deposited Ni film. Multiple deposition-irradiation iterations were performed in a single vacuum cycle. Investigation of cross sections showed that the coating-substrate (Ni-Cu surface alloy - Cu substrate) interface has a sufficiently developed curvilinear profile. It was found that the thickness of the transition layer of the coating decreases with an increase in the thickness of the sprayed film. The study of the adhesion strength by the scratch test method showed that the Ni-Cu surface alloy has better characteristics compared to the magnetron coating. The maximum adhesion strength was obtained for a Ni-Cu surface alloy formed by the deposition of a Ni film with a thickness of 0.125 μm. In this case, cracking and localized delamination of the coating occurred at critical loads of 15 and 17 N, respectively, while complete destruction of the coating was not observed.

Download file

Counter downloads: 90

Keywords

Authors

Name	Organization	E-mail
Yakovlev E.V.	Institute of High Current Electronics SB RAS	yakov_e@mail.ru
Markov A.B.	Institute of High Current Electronics SB RAS	almar@lve.hcei.tsc.ru
Shepel D.A.	Institute of High Current Electronics SB RAS	dashepel@lve.hcei.tsc.ru
Petrov V.I.	Institute of High Current Electronics SB RAS	seva-ne@mail.ru
Neyman A.A.	Institute of Strength Physics and Materials Science SB RAS	nasa@ispms.ru

Всего: 5

References

Neuville S. and Matthews A. // Thin Solid Films. - 2007. - V. 515. - P. 6619-6653.

Gerth J. and Wiklund U. // Wear. - 2008. - V. 264. - P. 885-892.

Weber M., Bewilogua K., Thomsen H., and Wittorf R. // Surf. Coat. Technol. - 2006. - V. 201. - P. 1576-1582.

Silva C., Alves E., Ramos A.R., et al. // Vacuum. - 2009. - V. 83. - P. 1213-1217.

Zhang S. and Xie H. // Surf. Coat. Technol. - 1999. - V. 113. - P. 120-125.

Broitman E. and Hultman L. // J. Phys. Conf. Ser. - 2012. - V. 370. - P. 012009.

Lukauskaitė R., Černašėjus O., Škamat J., et al. // Surf. Coat. Technol. - 2017. - V. 316. - P. 93-103.

Ostadi A., Hosseini S.H., and Fordoei M.E. // Ceram. Int. - 2020. - V. 46. - No. 2. - P. 2287-2293.

Batrakov A.V., Markov A.B., Ozur G.E., et al. // Eur. Phys. J. Appl. Phys. - 2008. - V. 43. - No. 3. - P. 283-288.

Jiang W., Wang L., and Wang X. // Nucl. Instrum. Methods Phys. Res. B. - 2018. - V. 436. - P. 6367.

Markov A.B., Mikov A.V., Ozur G.E., and Padei A.G. // Instrum. Exp. Tech. - 2011. - V. 54. - P. 862-866.

Musil J. and Vlček J. // Surf. Coat. Technol. - 1999. - V. 112. - No. 1-3. - P. 162-169.

Wang Y., Xing Z., Qi Y., et al. // J. Alloy. Compd. - 2019. - V. 789. - P. 887-893.

Lattemann M., Ehiasarian A.P., Bohlmark J., et al. // Surf. Coat. Technol. - 2006. - V. 200. -No. 22-23. - P. 6495-6499.

Markov A.B., Yakovlev E.V., and Petrov V.I. // IEEE Trans. Plasma Sci. - 2013. - V. 41. - No. 8. - P. 2177-2182.