The role of the energy of the packaging defect during deformation in the low-stable state of Cu - Al and Cu -Mn alloys

Transmission diffraction electron microscopy has been used to elucidate the role of packing defect energy (EDM) during active plastic deformation in the low-stable state of Cu - Al and Cu -Mn alloys. For this purpose, dislocation and dislocation-disclination structures in stretch-deformed polycrystals of HCC alloys of Cu-Al and Cu-Mn solid solutions with grain sizes of 20...240 microns have been studied. The studied concentration range was 0.5 - 14 at.% Al and 0.4 - 25at.% Mn. The interdependencies of the parameters characterizing the defective substructure and the energy of the packaging defect are established. The dependencies are compared with the structural-phase state of the alloys. It is established that the types of dislocation substructure (DSS) of alloys of both systems are largely similar. The only difference is that there is no micro-twinning in Cu - Mn alloys, which is observed in Cu-Al alloys. The influence of the energy of the packaging defect on the formation of the DSS and its parameters is traced.

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