Numerical modelling of volatile components removal during firing of ceramic-metal packages for integrated circuits
Numerical simulation of the process of removing volatile components from the porous space under the ceramic plate and from the area above the ceramic plate covered with a rough plate-weight during firing of ceramic-metal boards is carried out. The problem was solved using the ANSYS Fluent package. It is assumed that the roughness is described by a structured set of cones of different heights. It is shown that an increase in the height of the roughness peaks leads to a decrease in excess pressure above and below the ceramic plate.
Keywords
numerical modeling, roughness, removal of volatile components, ceramic-metal boards, gas pressureAuthors
| Name | Organization | |
| Zhukov Ilya A. | Tomsk State University | zhukoviatsu@yandex.ru |
| Krainov Aleksey Yu. | Tomsk State University | akrainov@ftf.tsu.ru |
| Moiseeva Ksenia M. | Tomsk State University | moiseeva_km@t-sk.ru |
| Ermolaev Evgenii V. | JSC «Semiconductor Devices Plant»; Mari State University | ermolaev_ev@zpp12.ru |
| Akhmetgaliev Ravil Sh. | Tomsk State University; JSC «Semiconductor Devices Plant» | rshahmetgaliev@zpp12.ru |
| Egoshin Valery A. | Tomsk State University; JSC «Semiconductor Devices Plant»; Mari State University | vaegoshin@zpp12.ru |
| Shugaepov Shamil N. | Tomsk State University; JSC «Semiconductor Devices Plant»; Mari State University | shnshugaepov@zpp12.ru |
References
Numerical modelling of volatile components removal during firing of ceramic-metal packages for integrated circuits | Izvestiya vuzov. Fizika. 2025. № 12. DOI: 10.17223/00213411/68/12/17